Reflowing Solder Paste
Last updated
Last updated
Alloys, Flux, T4, T5, Wetting - Not sure what this all means? Here's a crash course on solder paste.
We currently offer two types of solder paste alloys in T4 and T5 particle sizes:
Tin Bismuth Silver (Sn42 Bi57.6 Ag0.4) is RoHS compliant and is meant for our conductive inks. Tin Lead (Sn63 Pb37) is meant for factory fabricated boards with a HASL finish.
Before reflow soldering on the V-One, check the following:
Is your board larger than 3" x 4" ( 76.2 mm x 101.6 mm)?
Are you reflowing large components like connectors?
Does your board have multiple ground planes?
If you said YES to any of the above, then the automatic REFLOW mode may not work correctly. The board will act like a large heat sink and will not reach the peak reflow temperatures. Instead, you should use the MANUAL mode.
Tip: If your board will act like a large heat sink, do a MANUAL reflow instead (See below)
Automatic reflow profile for Tin Bismuth Silver (Sn42 Bi57.6 Ag0.4)
Solder paste can be reflowed up to 8 hours after dispensing, but for best results, reflow as soon as possible.
Automatic reflow profile for Tin Lead (Sn63 Pb37)
A manual reflow requires the user to place close attention to the board as it is reflowing. To perform a manual reflow:
Clamp your board on the heated bed.
Enter Heat > Manual mode.
Set the temperature to the soak temperature.
Hold for 1-2 minutes to let the whole board reach the temperature.
Set the temperature to the peak temperature.
Observe the solder paste closely.
As soon as the last pad finishes reflowing, hit STOP to start cooling the board.
Soak Temp.
Soak Time
Peak Temp.
Peak Time
140°C (284°F)
45 seconds
190°C (365°F)
30 seconds
Soak Temp.
Soak Time
Peak Temp.
Peak Time
180°C (356°F)
45 seconds
220°C (428°F)
30 seconds
Solder Alloy
Soak Temp.
Peak Temp.
Tin Bismuth Silver
140°C (284°F)
190°C (365°F)
Tin Lead
180°C (356°F)
220°C (428°F)
