# Reflowing Solder Paste

Before reflow soldering on the V-One, **check the following**:

* Is your board larger than 3" x 4" ( 76.2 mm x 101.6 mm)?
* Are you reflowing large components like connectors?
* Does your board have multiple ground planes?

If you said YES to any of the above, then the automatic **REFLOW** mode may not work correctly. The board will act like a large heat sink and will not reach the peak reflow temperatures. Instead, you should use the **MANUAL** mode.

{% hint style="info" %}
**Tip**: If your board will act like a large heat sink, do a **MANUAL** reflow instead (See below)
{% endhint %}

![](//images.ctfassets.net/e6vf9wdhbae5/7qRlLfCbCHwCqorz5XOqmD/ccce18937b496f14e8b74fade0a223da/reflow-mode.png)

#### Tin Bismuth Silver (Sn42 Bi57.6 Ag0.4) Profile

Automatic reflow profile for Tin Bismuth Silver (Sn42 Bi57.6 Ag0.4)

| **Soak Temp.** | **Soak Time** | **Peak Temp.** | **Peak Time** |
| -------------- | ------------- | -------------- | ------------- |
| 140°C (284°F)  | 45 seconds    | 190°C (365°F)  | 30 seconds    |

![](//images.ctfassets.net/e6vf9wdhbae5/22T7HTQwsJ16gmM1rBjYNV/627f1b60260e107db30e90d862126012/tinLeadBismuth.png)

{% hint style="info" %}
Solder paste can be reflowed up to 8 hours after dispensing, but for best results, reflow as soon as possible.
{% endhint %}

#### Tin Lead (Sn63 Pb37) Profile

Automatic reflow profile for Tin Lead (Sn63 Pb37)

| **Soak Temp.** | **Soak Time** | **Peak Temp.** | **Peak Time** |
| -------------- | ------------- | -------------- | ------------- |
| 180°C (356°F)  | 45 seconds    | 220°C (428°F)  | 30 seconds    |

![](//images.ctfassets.net/e6vf9wdhbae5/4WR6dFYAsYRrTWE1Tbg8hJ/e6c62d1a67b2a26764865ff5db0c9cbd/tinLead.png)

### Manual Reflow

A manual reflow requires the user to place close attention to the board as it is reflowing. To perform a manual reflow:

1. Clamp your board on the heated bed.
2. Enter **Heat** > **Manual** mode.
3. Set the temperature to the *soak temperature*.
4. Hold for 1-2 minutes to let the whole board reach the temperature.
5. Set the temperature to the *peak temperature*.
6. Observe the solder paste closely.
7. As soon as the last pad finishes reflowing, hit **STOP** to start cooling the board.

| **Solder Alloy**   | **Soak Temp.** | **Peak Temp.** |
| ------------------ | -------------- | -------------- |
| Tin Bismuth Silver | 140°C (284°F)  | 190°C (365°F)  |
| Tin Lead           | 180°C (356°F)  | 220°C (428°F)  |


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